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 Click to enlarge image
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SPECICIFATION
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NEONTECH AUTOMATIC DICING SAW NEON8010
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WorkPiece
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Size
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202mm ( 8" WAFER )
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X-Axis
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Useable stroke
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370mm
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Cut speed
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0.05-400 mm
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Y-Axis
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Useable stroke
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230 mm
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Indexing step
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0.0005 mm
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Indexing accuracy single pitch
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0.001 mm
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Indexing accuracy cumulative pitch
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0.001 mm
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Z-Axis
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Maximum cutting stroke
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60 (for 02" blade)
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Maximum step
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0.005 mm
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Repeating accuracy
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0.001 mm
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Maximum blade size
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76.2 mm
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Θ-Axis
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Rotation angle (Max) (DD servo)
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380
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Air Spindle
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Cut put
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1.5 kw
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Maximum revolution
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50000 rpm
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Vision System
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Auto Alignment
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Accuracy
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0.001 mm
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Size
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Machine Size
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840 W x 940 D x 1400 H
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Machine Weight
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750 Kg
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Option
1. 2-way vision camera system
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NEON-8010 is designed for
the exclusive use of both a silicon wafer (8") and a precision device
dicing. It is equipped with the optimal efficiency and condition of dicing
and designed with sufficient intensity and oscillation-resistance, so it
is neat and simple and provides an intuitive working environment
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