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Click to enlarge image
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SPECICIFATION
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NEONTECH AUTOMATIC DICING SAW NEON 6010
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WorkPiece
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Size
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153mm
( 6" WAFER )
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X-Axis
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Useable
stroke
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310mm
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Cut speed
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0.05-400
mm
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Y-Axis
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Useable
stroke
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180 mm
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Indexing
step
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0.0005
mm
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Indexing
accuracy single pitch
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0.001
mm
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Indexing
accuracy cumulative pitch
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0.001
mm
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Z-Axis
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Maximum
cutting stroke
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60 (for
02" blade)
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Maximum
step
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0.005
mm
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Repeating
accuracy
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0.001
mm
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Maximum
blade size
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76.2
mm
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Θ-Axis
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Rotation
angle (Max) (DD servo)
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350
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Air Spindle
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Cut put
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1.5 kw
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Maximum
revolution
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50000
rpm
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Vision
System
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Auto Alignment
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Accuracy
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0.001
mm
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Size
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Machine Size
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760 W x 860 D x 1400 H
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Machine Weight
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650 Kg
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Option
1. 2-way vision camera system
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NEON-6010
is designed for the exclusive use of both a silicon wafer (6") and
a precision device. It is equipped with the optimal efficiency and condition
of dicing and designed with sufficient intensity and oscillation-resistance,
so it is neat and simple and provides an intuitive working environment.
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